Abstract—The increasing number of transistors being clocked at high frequencies of modern microprocessors lead to an increasing power consumption, which calls for an active dynamic thermal management. In a research project a system environment has been developed, which includes thermal modeling of the microprocessor in the board system, a software environment to control the characteristics of the system’s timing behavior, and a modified Linux scheduler, which is enhanced with a prediction controller. Measurement results are shown for this development for a Freescale i.MX6Q quad-core microprocessor.

Index Terms—Dynamic thermal management (DTM), multi-core processing, thermal modeling.

The authors are with the Laboratory Embedded Systems and Communication Electronics, Offenburg University of Applied Sciences D77652 Offenburg, Germany.

Cite:Axel Sikora, Sebouh Toumassian, "Dynamic Thermal Management for Homogeneous Embedded Multicore Processors: Thermal Modeling, System Environment, and Measurement Results," International Journal of Computer and Electrical Engineering vol. 7, no. 4, pp. 223-231, 2015.