Volume 7 Number 4 (Aug. 2015)
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IJCEE 2015 Vol.7(4): 223-231 ISSN: 1793-8163
DOI: 10.17706/IJCEE.2015.7.4.223-231

Dynamic Thermal Management for Homogeneous Embedded Multicore Processors: Thermal Modeling, System Environment, and Measurement Results

Axel Sikora, Sebouh Toumassian
Abstract—The increasing number of transistors being clocked at high frequencies of modern microprocessors lead to an increasing power consumption, which calls for an active dynamic thermal management. In a research project a system environment has been developed, which includes thermal modeling of the microprocessor in the board system, a software environment to control the characteristics of the system’s timing behavior, and a modified Linux scheduler, which is enhanced with a prediction controller. Measurement results are shown for this development for a Freescale i.MX6Q quad-core microprocessor.

Index Terms—Dynamic thermal management (DTM), multi-core processing, thermal modeling.

The authors are with the Laboratory Embedded Systems and Communication Electronics, Offenburg University of Applied Sciences D77652 Offenburg, Germany.

Cite:Axel Sikora, Sebouh Toumassian, "Dynamic Thermal Management for Homogeneous Embedded Multicore Processors: Thermal Modeling, System Environment, and Measurement Results," International Journal of Computer and Electrical Engineering vol. 7, no. 4, pp. 223-231, 2015.

General Information

ISSN: 1793-8163 (Print)
Abbreviated Title: Int. J. Comput. Electr. Eng.
Frequency: Quarterly
Editor-in-Chief: Prof. Yucong Duan
Abstracting/ Indexing: EI (INSPEC, IET), Ulrich's Periodicals Directory, Google Scholar, EBSCO, ProQuest, and Electronic Journals Library
E-mail: ijcee@iap.org

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