Abstract—Thermal actuators are extensively used in microelectromechanical systems (MEMS). Heat transfer through and around these microstructures are very complex. Knowing and controlling them in order to improve the performance of the micro-actuator, is currently a great challenge. This paper deals with this topic and proposes a dynamic thermal modeling of thermal micro-actuators. Actuator deflection is computed based on elastic analysis of structures. The model predicts the performance of a polysilicon thermal flexure actuator has been developed. The thermal actuators are designed using Thermal stress in Structural mechanics of COMSOL Multiphysics 4.3. The result of modulation and analysis shows the better displacement for the temperature ranges. Actuator deflection is computed based on elastic analysis of structures. Varying the applied voltage and geometrical dimension gives a clear understanding about the performance of the structure.

Index Terms—MEMS, actuators, thermal analysis, modeling FEM.

Girija M. Nimbal is with Department of Electronics, Karnataka State Women’s University, Bijapur, India (e-mail: girija_mnimbal@yahoo.com).
S. V. Halse is with Registrar Evaluation, Gulbarga University, Gulbarga (e-mail: drsvhalse@rediffmail.com).
R. S. Mathad is with Department of Electronics, Basavewhar Science Degree Collage, Bagalkot, India (e-mail: rmathad@gmail.com).
B. Jyoti is with Department of Electronics, Bibi Razak Degree College, Gulbarga, India (e-mail: bjyoti1967@gmail.com).
Rafia Begum is with the Department of E and E Governrnment Polytechnique Bijapur, India (e-mail: begumrafiya86@gmail.com).

Cite:Girija M. Nimbal, S. V. Halse, R. S. Mathad, B. Jyoti, and Rafia Begum, "Modeling and Analysis of Thermal Flexure Actuator Using COMSOL Multiphysics," International Journal of Computer and Electrical Engineering vol. 6, no.4, pp. 294-298, 2014.