Volume 6 Number 2 (Apr. 2014)
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IJCEE 2014 Vol.6 (2): 72-76 ISSN: 1793-8163
DOI: 10.7763/IJCEE.2014.V6.797

Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards

N. Tidjani, J. C. Le Bunetel, A. Ouchar, and Y. Raingeaud
Abstract—In this work, a characterization of coupled transmission lines used in integrated circuit packaging on printed circuit boards is presented. The method proposed is based on the method of moments and mathematical model based on analytical equations for fast extraction of parameters per unit length of coupled transmission lines lossless. The charge distribution is evaluated only once using the method of moments, in order to calculate per unit length parameters of capacity matrix in the presence of substrate. The elements per unit length of inductance matrix are then calculated by mathematical model based on analytical and empirical equations.

Index Terms—Method of moments, multiconductor lines parameters per unit length, packaging, PCB.

Nassima Tidjani, Ali Ouchar are with University of Laghouat, Algeria (n.tidjani@mail.lagh-univ.dz).
Jean-Charles Le Bunetel, Yves Raingeaud are with University of François- Rabelais, Tours, France (lebunetel@univ-tours.fr)

 

Cite:N. Tidjani, J. C. Le Bunetel, A. Ouchar, and Y. Raingeaud, "Characterization of Coupled Transmission Lines Used in Integrated Circuit Packaging on Printed Circuit Boards," International Journal of Computer and Electrical Engineering vol. 6, no.2, pp. 72-76, 2014.

General Information

ISSN: 1793-8163 (Print)
Abbreviated Title: Int. J. Comput. Electr. Eng.
Frequency: Quarterly
Editor-in-Chief: Prof. Yucong Duan
Abstracting/ Indexing: EI (INSPEC, IET), Ulrich's Periodicals Directory, Google Scholar, EBSCO, ProQuest, and Electronic Journals Library
E-mail: ijcee@iap.org

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